• BS 9766:1983

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Specification for printed circuits of assessed quality: sectional specification for multilayer flexi-rigid printed circuits with through hole connections

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  15-12-2000

    Language(s):  English

    Published date:  30-12-1983

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Committees responsible
    Specification
    1 Scope
    2 Related documents
    3 Terminology
    4 Base materials
    5 Customer's detail specification
    6 Inspection requirements
    7 Description of capability: limits of approval
    8 Demonstration of capability
    9 Capability CTP allocation
    10 Capability approval acceptance levels
    11 Capability approval report
    12 Abstract of description of capability
    13 Quality conformance inspection
    14 Certified test records
    15 BS 9764 approval
    Appendices
    A CTP materials and finishes
    B CTP test pattern locations
    C Layout of composite of all V layers for extension of
        approval for more than six layers
    D Layout of specimens A, B, G and Y
    E Layout of specimen C
    F Layout of specimens D and E
    G Layout of specimens F and K
    H Layout of specimens L and N
    J Layout of specimen P
    K Layout of specimens M and H
    L Layout of specimens J, X, Z1 and Z2
    M CTP finished hole sizes and cover layer hole sizes
        in the group pattern layout
    N CTP layout
    P Representation of six-, eight-, ten- and twelve-
        layer construction
    Q Example of abstract of description of capability for
        inclusion in PD 9002
    R Customer's detail specification
    S Examples of delamination
    T Examples of hole defects
    U Test method for flexural fatigue (hinge) of
        specimens Z1 and Z2
    V Notes applicable to appendices D to L
    Tables
    1 CTP allocation of specimens
    2 Schedule of tests for capability approval
    3 Quality conformance inspection
    Figure
    1 Group pattern for 1 CTP

    Abstract - (Show below) - (Hide below)

    Specifies the tests and requirements from those listed in BS 9760 that are applicable to multilayer flexi-rigid printed circuits with through-hole connections and also the requirements for capability approval and for quality conformance inspection during manufacture.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    BS 2011-2.1Ca:1977 Environmental testing. Tests Test Ca. Damp heat, steady state
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