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BS CECC 123400-003:1994
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Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections
Hardcopy , PDF
English
15-02-1994
Committees responsible
Foreword
Specification
1 General
2 Capability qualifying component (CQC)
3 Capability approval
4 Capability test programme
5 Traceability
Appendices
A Untitled
B Untitled
C Untitled
D Untitled
E Edge connector imperfections
F Adhesion of plating: tape method
G Porosity of platings - method of test
H Solvent resistance of organic coatings
J Solder resistance of organic coatings
Tables
I Capability approval test schedule
IIa Additional metallic conductor finishes
IIb Additional contact finishes
III Permanent organic finishes
IV Bonded stiffeners and rigidizers
Figures
1a Composite test pattern for flexible printed boards
without through connections
1b Detailed dimensions of specimens shown in figure 1a
2 Test pattern for marking inks
3 Test pattern for solder mask or coverlayer
4a Assembly of test pattern rigidizers or stiffeners
4b Component parts of test pattern for rigidizers or
stiffeners
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