BS EN 60068-2-69:2017+A1:2019
Current
The latest, up-to-date edition.
Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Hardcopy , PDF
English
11-09-2019
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| ISBN |
9780539000160
|
| Pages |
60
|
| ProductNote |
THIS STANDARD ALSO REFERS TO EIA/IPC/JEDEC J-STD-002D,IPC J-STD-003C
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass–fail purposes.
The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads.
This document provides the measurement procedures for solder alloys both with and without lead (Pb).
| Standards | Relationship |
| EN 60068-2-69:2017/A1:2019 | Identical |
| IEC 60068-2-69:2017+AMD1:2019 CSV | Identical |
| IEC 60068-2-69:2017/AMD1:2019 | Identical |
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