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  • BS EN 60068-2-69:2017

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    Environmental testing Tests. Test Te/Tc. Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  30-09-2019

    Language(s):  English

    Published date:  09-05-2018

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General description of the method
    5 Description of the test apparatus
    6 Preparation of specimens
    7 Materials
    8 Procedure
    9 Presentation of results
    10 Information to be given in the relevant specification
    Annex A (normative) - Equipment specification
    Annex B (informative) - Use of the wetting balance for
            SMD solderability testing
    Annex C (normative) - Test methods for SMD components
            sizes 0603M (0201) or smaller
    Annex D (informative) - Evaluation criteria - Guidance
    Annex E (informative) - Method of calculating the maximum
            theoretical force and integrated value of the area of the
            wetting curve for leaded non-SMD
    Bibliography
    Annex ZA (normative) - Normative references to
           international publications with their
           corresponding European publications

    Abstract - (Show below) - (Hide below)

    Defines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations.

    Scope - (Show below) - (Hide below)

    This part of IEC60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations. Data obtained by these methods are not intended to be used as absolute quantitative data for pass-fail purposes. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method. They are applicable to components and printed boards with metallic terminations and metallized solder pads. This document provides the measurement procedures for solder alloys both with and without lead (Pb).

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    Committee EPL/501
    Development Note Supersedes 93/213653 DC. (09/2005) Supersedes 05/30139830 DC. (07/2007) Supersedes 14/30309696 DC & BS EN 60068-2-54. (07/2017)
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    ISO 9454-1:2016 Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging
    IPC J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    IEC 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    EN 60068-2-66:1994 Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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