BS EN 60191-6-19:2010
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Hardcopy , PDF
English
30-06-2010
1 Scope
2 Normative references
3 Terms and definitions
4 Sample
5 Measurement
6 Maximum permissible package warpage at elevated
temperature
7 Recommended datasheet for the package warpage
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 08/30172909 DC. (06/2010)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
| Standards | Relationship |
| IEC PAS 60191-6-19:2008 | Identical |
| IEC 60191-6-19:2010 | Identical |
| EN 60191-6-19:2010 | Identical |
| IEC 61010-2-030:2010 | Identical |
| I.S. EN 60191-6-19:2010 | Equivalent |
| DIN EN 60191-6-19:2010-10 | Equivalent |
| UNE-EN 60191-6-19:2010 | Equivalent |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : Users cannot be edited or removed once added to your Multi user PDF.