IEC 60191-6-19:2010
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Hardcopy , PDF
English - French
25-02-2010
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Sample
5 Measurement
6 Maximum permissible package warpage at elevated
temperature
7 Recommended datasheet for the package warpage
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
| Committee |
TC 47/SC 47D
|
| DevelopmentNote |
Supersedes IEC PAS 60191-6-19. (02/2010) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NEN EN IEC 60191-6-19 : 2010 | Identical |
| I.S. EN 60191-6-19:2010 | Identical |
| PN EN 60191-6-19 : 2010 | Identical |
| BS EN 60191-6-19:2010 | Identical |
| CEI EN 60191-6-19 : 2011 | Identical |
| EN 60191-6-19:2010 | Identical |
| DIN EN 60191-6-19:2010-10 | Identical |
| UNE-EN 60191-6-19:2010 | Identical |
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