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BS EN 60191-6-6:2001

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine pitch land grid array (FLGA) - Proposed amendment on terminology

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

05-09-2001

€165.94
Excluding VAT

Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
  3.1 Flanged type
  3.2 Type of real chip size
  3.3 FLGA
  3.4 Material designation
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Gives common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0.80 mm and whose package body outline is square.

Committee
EPL/47
DevelopmentNote
Also numbered as IEC 60191-6-6. (09/2001)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Current

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.

Standards Relationship
DIN EN 60191-6-6:2002-02 Identical
SN EN 60191-6-6 : 2001 Identical
NF EN 60191-6-6 : 2002 Identical
UNE-EN 60191-6-6:2002 Identical
I.S. EN 60191-6-6:2001 Identical
EN 60191-6-6:2001 Identical

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