BS EN 60249-2-16:1993
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Specifications Specification No. 16. Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
Hardcopy , PDF
01-10-2006
English
15-06-2001
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Committees responsible
National foreword
Foreword
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad sheet
7 Non-electrical properties of the base material after
complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex ZA (normative) Other international publications
quoted in this standard with the references
of the relevant European publications
Requirements for sheets of thickness of 0.5 mm up to 6.4 mm.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS 4584-102.16(1992) Also numbered as IEC 60249-2-16 (06/2001) 1993 version incorporates amendment 8015 to BS 4584-102.16(1992). Supersedes 89/27822 DC and 98/232807 DC. (04/2005)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| UNE-EN 60249-2-16:1997 | Identical |
| DIN EN 60249-2-16:2001-09 | Identical |
| EN 60249-2-16 : 1993 AMD 3 2000 | Identical |
| SN EN 60249-2-16 : 1993 AMD 3 2000 | Identical |
| I.S. EN 60249-2-16:1996 | Identical |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
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