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BS EN 60249-2-17:1993

BS EN 60249-2-17:1993

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Specifications Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards

Available format(s)

Hardcopy , PDF

Withdrawn date

01-10-2006

Language(s)

English

Published date

15-06-2001

Publisher

British Standards Institution

Foreword
1 Scope
2 Normative references
3 Materials and construction
4 Internal marking
5 Electrical properties
6 Non-electrical properties of the copper-clad sheet
7 Non-electrical properties of the base material
   after complete removal of the copper foil
8 Packaging and marking
9 Acceptance testing
Annex ZA (normative) Other international publications
         quoted in this standard with the references
         of the relevant European publications

Gives requirements for properties of thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability to be used in the fabrication of multilayer printed boards. Covers laminated sheets that have thicknesses (of the base laminate, excluding the copper foil) not in excess of 0,8 mm (0,031 in). The materials, although primarily meant for multilayer boards, may be used for single-sided or double-sided printed boards. Coverage includes materials and construction, internal marking, electrical properties and acceptance testing.

Committee
EPL/501
DevelopmentNote
Also numbered as IEC 60249-2-17 Renumbers and supersedes BS 4584-102.17(1992). 1993 version incorporates amendment 8016 to BS 4584-102.17(1992). Supersedes 89/27823 DC and 98/232808 DC. (04/2005)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Withdrawn
Supersedes

IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

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