BS EN 60749-9:2017
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods Permanence of marking
Hardcopy , PDF
English
27-11-2017
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Equipment
5 Safety precautions
6 Procedure
7 Failure criteria
8 Summary
Bibliography
Describes whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 00/203566 DC (10/2002) Supersedes BS EN 60749. (09/2005) Supersedes 16/30345063 DC. (12/2017)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
The purpose of this part of IEC 60749 is to determine whether the marks on solid state semiconductor devices will remain legible when subjected to the application and removal of labels or the use of solvents and cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board manufacturing process.
This test is applicable for all package types. It is suitable for use in qualification and/or process monitor testing. The test is considered non-destructive. Electrical or mechanical rejects can be used for the purpose of this test.
NOTE 1 This procedure does not apply to laser branded packages.
Many available solvents that could be used are either not sufficiently active, too stringent, or even dangerous to humans when in direct contact or when fumes are inhaled.
NOTE 2 The composition of solvents used in this document is considered typical and representative of the desired stringency as far as the usual coatings and markings are concerned.
| Standards | Relationship |
| IEC 60749-9:2017 | Identical |
| NBN EN 60749-9 : 2003 | Identical |
| DIN EN 60749-9:2016-09 (Draft) | Identical |
| I.S. EN 60749-9:2017 | Identical |
| UNE-EN 60749-9:2003 | Identical |
| NF EN 60749-9 : 2002 | Identical |
| EN 60749-9:2017 | Identical |
| IEC 61340-2-3:2016 | Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation |
| FED-STD-101 Revision C:1980 | TEST PROCEDURES FOR PACKAGING MATERIALS |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.