BS EN 61189-5-3:2015
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies
Hardcopy , PDF
English
30-04-2015
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
4 X: Miscellaneous test methods
Annex A (informative) - Typical comparison of particle
size distributions between laser diffraction
method and screen method
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines methodologies and procedures that can be applied to test printed board assemblies.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS IEC 61189-5-3. 2015 version incorporates corrigendum to BS IEC 61189-5-3. Supersedes 12/30274800 DC. (04/2015)
|
| DocumentType |
Standard
|
| Pages |
46
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
This part of IEC 61189 focuses on test methods for soldering paste based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering paste for lead free soldering.
| Standards | Relationship |
| IEC 61189-5-3:2015 | Identical |
| EN 61189-5-3:2015 | Identical |
| DIN EN 61189-5-3:2015-11 | Equivalent |
| I.S. EN 61189-5-3:2015 | Equivalent |
| UNE-EN 61189-5-3:2015 | Equivalent |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : Users cannot be edited or removed once added to your Multi user PDF.