I.S. EN 61189-5-3:2015
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
Hardcopy , PDF
English
01-01-2015
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
4 X: Miscellaneous test methods
Annex A (informative) - Typical comparison of particle
size distributions between laser diffraction
method and screen method
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines methodologies and procedures that can be applied to test printed board assemblies.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
92
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 61189-5-3:2015 | Identical |
| BS EN 61189-5-3:2015 | Equivalent |
| DIN EN 61189-5-3:2015-11 | Equivalent |
| IEC 61189-5-3:2015 | Equivalent |
| UNE-EN 61189-5-3:2015 | Equivalent |
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