BS EN 61191-6:2010

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Voids in solder joints
5 Measurement
6 Void occupancy
7 Evaluation
Annex A (informative) - Experimental results and simulation of
        voids and decrease of life due to thermal stress
Annex B (informative) - X-ray transmission equipment
Annex C (informative) - Voids in BGA solder ball
Annex D (informative) - Measurement using X-ray transmission
        imaging
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications
Bibliography

Describes the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation.

IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.