BS EN 61249-7-1:1996
Current
The latest, up-to-date edition.
Materials for interconnection structures. Sectional specification set for restraining core materials Copper/invar/copper
Hardcopy , PDF
English
15-08-1996
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Committees responsible
National foreword
1 Scope
2 Normative references
3 Materials and construction
4 Electrical properties
5 Non-electrical properties
6 Surface treatment
7 Packaging and marking
Annex
ZA (normative) Normative references to international
publications with their corresponding European
publications
Details requirements for copper-clad Invar material for use in the fabrication of metal laminated sheets, used for printed boards. This material modifies some properties of the boards, for example thermal capacity and thermal expansion. Covers copper-clad Invar material of nominal thickness from 0,1 mm to 2,4 mm and is mainly for rolls of copper-clad Invar material, but if purchaser and supplier agree may also apply to sheets.
| Committee |
EPL/501
|
| DevelopmentNote |
Also numbered as IEC 61249-7-1 (11/2005)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| SN EN 61249-7-1 : 1995 | Identical |
| UNE-EN 61249-7-1:1997 | Identical |
| EN 61249-7-1:1995 | Identical |
| DIN EN 61249-7-1:1996-01 | Identical |
| I.S. EN 61249-7-1:1998 | Identical |
| BS 6221-21:2001 | Printed wiring boards Guide to the rework of unassembled boards |
| BS 5714:1979 | Method of measurement of resistivity of metallic materials |
| BS EN 60249-1:1993 | Base materials for printed circuits Base materials for printed circuits. Test methods |
| ISO 178:2010 | Plastics Determination of flexural properties |
| BS EN 10002-1:2001 | Tensile testing of metallic materials Method of test at ambient temperature |
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