BS EN 61300-3-3:2009

1 Scope
2 Normative references
3 General description
  3.1 Test method
  3.2 Precautions
4 Apparatus
  4.1 Methods 1, 2 and 3
      4.1.1 General
      4.1.2 Source (S)
      4.1.3 Launch condition (E)
      4.1.4 Monitoring equipment
      4.1.5 Detector D
      4.1.6 Stress fixture
      4.1.7 Branching device BD
      4.1.8 Temporary joints
      4.1.9 Data acquisition
      4.1.10 Monitor sample
      4.1.11 Reference fibre
  4.2 Methods 4 and 5
      4.2.1 General
      4.2.2 OTDR
      4.2.3 Buffer fibre
      4.2.4 Optical switches
5 Procedure
  5.1 Monitoring attenuation and return loss of a single
      sample - method 1
      5.1.1 General
      5.1.2 Attenuation monitoring - method 1
      5.1.3 Return loss monitoring - method 1
  5.2 Monitoring attenuation and return loss of multiple
      samples using a 1 x N branching device -
      method 2
      5.2.1 General
      5.2.2 Attenuation monitoring - method 2
      5.2.3 Return loss monitoring - method 2
  5.3 Monitoring attenuation and return loss of multiple
      samples using two 1 x N optical switches -
      method 3
      5.3.1 General
      5.3.2 Attenuation - method 3
      5.3.3 Return loss - method 3
  5.4 Bidirectional OTDR monitoring of attenuation
      and return loss of multiple samples -
      method 4
      5.4.1 General
      5.4.2 Attenuation - method 4
      5.4.3 Return loss - method 4
  5.5 Unidirectional OTDR monitoring of attenuation
      and return loss of multiple samples -
      method 5
6 Details to be specified
  6.1 Method 1
  6.2 Methods 2 and 3
  6.3 Methods 4 and 5
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Specifies the procedure to monitor changes in attenuation and/or return loss of a component or an interconnecting device, when subjected to an environmental or mechanical test.

IEC 61300-3-3:2009 describes the procedure to monitor changes in attenuation and/or return loss of a component or an interconnecting device, when subjected to an environmental or mechanical test. Such a procedure is commonly referred to as active monitoring. In many instances, it is more efficient to monitor attenuation and return loss at the same time. This edition constitutes a minor revision. The change with respect to the previous edition is the structure of the document.