• BS EN 62047-11:2013

    Current The latest, up-to-date edition.

    Semiconductor devices. Micro-electromechanical devices Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  31-10-2013

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative References
    3 Symbols and designations
    4 Test piece
    5 Testing method and test apparatus
    6 Test report
    Annex A (informative) - Test piece fabrication
    Annex B (informative) - Test piece handling example
    Annex C (informative) - Test piece releasing process
    Annex D (informative) - Out-of-plane test setup
            and test piece example
    Annex E (informative) - Data analysis example in
            in-plane test method
    Annex F (informative) - Data analysis example in
            out-of-plane test method
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Describes the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 [mu]m and 1 mm and thickness between 0,1 [mu]m and 1 mm, which are main structural materials used for MEMS, micromachines and others.

    Scope - (Show below) - (Hide below)

    IEC 62047-11:2013 specifies the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric, etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 micrometre and 1 mm and thickness between 0,1 micrometre and 1 mm, which are main structural materials used for MEMS, micromachines and others. This test method is applicable for the CLTE measurement in the temperature range from room temperature to 30 % of a material\'s melting temperature.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes 10/30211446 DC. (10/2013)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    ASTM E 228 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push-Rod Dilatometer
    IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
    EN 62047-3 : 2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
    ASTM E 289 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Rigid Solids with Interferometry
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