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    I.S. EN 62047-11:2013

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 11: TEST METHOD FOR COEFFICIENTS OF LINEAR THERMAL EXPANSION OF FREE-STANDING MATERIALS FOR MICRO-ELECTROMECHANICAL SYSTEMS (IEC 62047-11:2013 (EQV))

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2013

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative References
    3 Symbols and designations
    4 Test piece
    5 Testing method and test apparatus
    6 Test report
    Annex A (informative) - Test piece fabrication
    Annex B (informative) - Test piece handling example
    Annex C (informative) - Test piece releasing process
    Annex D (informative) - Out-of-plane test setup
            and test piece example
    Annex E (informative) - Data analysis example in
            in-plane test method
    Annex F (informative) - Data analysis example in
            out-of-plane test method
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Describes the test method to measure the linear thermal expansion coefficients (CLTE) of thin free-standing solid (metallic, ceramic, polymeric etc.) micro-electro-mechanical system (MEMS) materials with length between 0,1 mm and 1 mm and width between 10 [mu]m and 1 mm and thickness between 0,1 [mu]m and 1 mm, which are main structural materials used for MEMS, micromachines and others.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    ASTM E 228 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Solid Materials With a Push-Rod Dilatometer
    IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
    EN 62047-3 : 2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
    ASTM E 289 : 2017 : REDLINE Standard Test Method for Linear Thermal Expansion of Rigid Solids with Interferometry
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