BS EN 62047-13:2012
Current
The latest, up-to-date edition.
Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
Hardcopy , PDF
English
31-05-2012
1 Scope
2 Normative references
3 Terms and definitions
4 Test method
5 Test equipment
6 Test pieces
7 Test conditions
8 Test report
Annex A (informative) - Technical background
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.