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IEC 62047-13:2012

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

28-02-2012

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test method
5 Test equipment
6 Test pieces
7 Test conditions
8 Test report
Annex A (informative) - Technical background
Bibliography

IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 μm to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.

DevelopmentNote
Stability date: 2018. (09/2017)
DocumentType
Standard
Pages
30
PublisherName
International Electrotechnical Committee
Status
Current

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

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