BS EN 62047-22:2014
Current
The latest, up-to-date edition.
Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
Hardcopy , PDF
English
31-10-2014
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1 Scope
2 Normative references
3 Terms, definitions, symbols
and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Defines a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates.
| Committee |
EPL/47
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This part of IEC62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.
| Standards | Relationship |
| EN 62047-22:2014 | Identical |
| IEC 62047-22:2014 | Identical |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| EN 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
| EN 62047-3 : 2006 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING |
| EN 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| ISO 527-3:1995 | Plastics Determination of tensile properties Part 3: Test conditions for films and sheets |
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