BS EN 62258-2:2011

INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements
5 Device Data eXchange format (DDX) file goals and usage
6 DDX file format and file format rules
7 DDX file content
8 Definitions of DEVICE block parameters
Annex A (informative) - An example of a DDX DEVICE block
Annex B (informative) - Groups and Permutation
Annex C (informative) - A Typical CAD view from the DDX
        file block example given in Annex A
Annex D (informative) - Properties for Simulation
Annex E (informative) - TERMINAL and TERMINAL_TYPE
        graphical usage for CAD/CAM systems
Annex F (informative) - Cross-reference with IEC 61360-4
Annex G (informative) - Notes on VERSION and NAME
        parameters
Annex H (informative) - Notes on WAFER parameters
Annex I (informative) - Additional notes
Annex J (informative) - DDX Version history
Annex K (informative) - Parse Control
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360.

IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition.

This publication is to be read in conjunction with IEC 62258-1:2009.