DIN EN 62258-2:2011-12

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements
5 Device Data eXchange format (DDX) file goals
  and usage
6 DDX file format and file format rules
7 DDX file content
  7.1 DDX file content rules
  7.2 DDX DEVICE block syntax
  7.3 DDX data syntax
8 Definitions of DEVICE block parameters
  8.1 BLOCK_CREATION_DATE Parameter
  8.2 BLOCK_VERSION Parameter
  8.3 VERSION Parameter
  8.4 DEVICE_FORM Parameter
  8.5 DEVICE_NAME Parameter
  8.6 DIE_MASK_REVISION Parameter
  8.7 MANUFACTURER Parameter
  8.8 DIE_NAME Parameter
  8.9 DIE_PACKAGED_PART_NAME Parameter
  8.10 FUNCTION Parameter
  8.11 DATA_SOURCE Parameter
  8.12 DATA_VERSION Parameter
  8.13 GEOMETRIC_UNITS Parameter
  8.14 GEOMETRIC_VIEW Parameter
  8.15 SIZE Parameter
  8.16 THICKNESS Parameter
  8.17 GEOMETRIC_ORIGIN Parameter
  8.18 SIZE_TOLERANCE Parameter
  8.19 THICKNESS_TOLERANCE Parameter
  8.20 TERMINAL_COUNT Parameter
  8.21 TERMINAL_TYPE_COUNT Parameter
  8.22 CONNECTION_COUNT Parameter
  8.23 TERMINAL_TYPE Parameter
  8.24 TERMINAL Parameter
  8.25 IC_TECHNOLOGY Parameter
  8.26 DIE_SEMICONDUCTOR_MATERIAL Parameter
  8.27 DIE_SUBSTRATE_MATERIAL Parameter
  8.28 DIE_SUBSTRATE_CONNECTION Parameter
  8.29 DIE_PASSIVATION_MATERIAL Parameter
  8.30 DIE_TERMINAL_MATERIAL Parameter
  8.31 DIE_BACK_DETAIL Parameter
  8.32 WAFER_SIZE Parameter
  8.33 MAX_TEMP Parameter
  8.34 POWER_RANGE Parameter
  8.35 TEMPERATURE_RANGE Parameter
  8.36 Simulator MODEL FILE Parameter
  8.37 Simulator MODEL FILE DATE Parameter
  8.38 Simulator NAME Parameter
  8.39 Simulator VERSION Parameter
  8.40 Simulator COMPLIANCE Parameter
  8.41 DIE_DELIVERY_FORM Parameter
  8.42 PACKING_CODE Parameter
  8.43 BUMP_MATERIAL Parameter
  8.44 BUMP_HEIGHT Parameter
  8.45 BUMP_HEIGHT_TOLERANCE Parameter
  8.46 MPD_PACKAGE_MATERIAL Parameter
  8.47 MPD_PACKAGE_STYLE Parameter
  8.48 MPD_DELIVERY_FORM Parameter
  8.49 MPD_CONNECTION_TYPE Parameter
  8.50 MPD_CONNECTION_MATERIAL Parameter
  8.51 FIDUCIAL_TYPE Parameter
  8.52 FIDUCIAL Parameter
  8.53 WAFER_DIE_STEP_SIZE Parameter
  8.54 WAFER_GROSS_DIE_COUNT Parameter
  8.55 WAFER_INDEX Parameter
  8.56 WAFER_RETICULE_STEP_SIZE Parameter
  8.57 WAFER_RETICULE_GROSS_DIE_COUNT Parameter
9 DDX EXPRESS model schema
  9.1 Type definitions
  9.2 File structure
  9.3 Device names
  9.4 Device block
  9.5 Die size
  9.6 Bare or bumped die type
  9.7 Bare die type
  9.8 Bumped bare die type
  9.9 Lead-frame die type
  9.10 Minimally packaged device
  9.11 Die delivery forms
  9.12 Terminal types
  9.13 Rectangular terminal
  9.14 Circular terminal
  9.15 Elliptic terminal
  9.16 Polygonal terminal
  9.17 Terminals
  9.18 Simulation data
  9.19 Fiducial type
  9.20 Fiducial
  9.21 Die and feature size
  9.22 Position
  9.23 Orientation
  9.24 Date
  9.25 Substrate connection
  9.26 Wafer index
Annex A (informative) Example of a DDX DEVICE block
Annex B (informative) Example of DDX data in STEP Physical
                       FILE (SPF) format
Annex C (informative) Typical CAD view from the DDX file block
                       example given in Annex A
Annex D (informative) Properties for simulation
Annex E (informative) TERMINAL and TERMINAL_TYPE graphical usage
                       for CAD/CAM systems
Annex F (informative) Cross-reference with IEC 61360-4
Annex G (informative) Notes on VERSION and NAME parameters
Annex H (informative) Notes on WAFER parameters
Annex I (informative) additional notes
Annex J (informative) DDX version history
Bibliography
Annex ZA (normative) Normative references to international
                       publications with their corresponding
                       European publications