BS EN IEC 60191-1:2018
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of discrete devices
Hardcopy , PDF
English
30-04-2018
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
EPL/47
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| DevelopmentNote |
Supersedes BS IEC 60191-1. (06/2018)
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| DocumentType |
Standard
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| Pages |
44
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| PublisherName |
British Standards Institution
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| Status |
Current
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| Supersedes |
IEC60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.
This edition includes the following significant technical changes with respect to the previous edition:
a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;
b) a definition of the term \'stand-off\' has been added;
c) the methods for locating the datum have been extended to be suitable for SMD-packages;
d) the visual identification of terminal position one for automatic handling has been clarified;
e) the rules for the drawing of terminals have been clarified;
f) Table A.1 has been completed with symbols specifically for SMD-packages;
g) Annex B \'Standardization philosophy\' has been deleted;
h) a normative Annex with special rules for SMD-packages has been added;
i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.
| Standards | Relationship |
| EN 60229:2008 | Identical |
| IEC 60191-1:2007 | Identical |
| IEC 60191-1:2018 | Identical |
| EN IEC 60191-1:2018 | Identical |
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