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  • EN IEC 60191-1:2018

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

    Available format(s): 

    Language(s): 

    Published date:  30-03-2018

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General rules for all drawings
    5 Additional rules
    6 Inter-conversion of inch and millimetre dimensions
      and rules for rounding off
    7 Rules for coding
    Annex A (informative) - Reference letter symbols
    Annex B (informative) - Rules to specify the dimensions
            and positions of terminals on a base drawing
    Annex C (normative) - General philosophy of flat base devices
    Annex D (normative) - Special rules for SMD-packages
    Annex E (informative) - Examples of semiconductor
             device drawings
    Annex F (informative) - Former rules for rounding off
    Annex G (informative) - Former rules for coding
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    IEC60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8.

    This edition includes the following significant technical changes with respect to the previous edition:

    a) the Scope has been extended to include surface-mounted semiconductor devices with a lead count less than 8;

    b) a definition of the term "stand-off" has been added;

    c) the methods for locating the datum have been extended to be suitable for SMD-packages;

    d) the visual identification of terminal position one for automatic handling has been clarified;

    e) the rules for the drawing of terminals have been clarified;

    f) Table A.1 has been completed with symbols specifically for SMD-packages;

    g) Annex B "Standardization philosophy" has been deleted;

    h) a normative Annex with special rules for SMD-packages has been added;

    i) the examples of semiconductor device drawings have been aligned to state-of-the-art packages including SMD-packages.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 47D
    Development Note Supersedes & Redesignates EN 60191-1. (04/2018)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
    IEC 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
    ISO 5459:2011 Geometrical product specifications (GPS) — Geometrical tolerancing — Datums and datum systems
    IEC 60191-6-21:2010 Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
    EN 60191-6-3:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    EN 60191-6-21 : 2010 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
    EN 60191-6-1:2001 Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
    ISO 261:1998 ISO general purpose metric screw threads General plan
    ISO 370:1975 Toleranced dimensions Conversion from inches into millimetres and vice versa
    IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
    EN 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
    ISO 263:1973 ISO inch screw threads General plan and selection for screws, bolts and nuts Diameter range 0,06 to 6 in
    IEC 60191-6-20:2010 Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
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