BS EN IEC 60749-26:2018

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Apparatus and required equipment
5 Stress test equipment qualification and routine verification
6 Classification procedure
7 Failure criteria
8 Component classification
Annex A (informative) - HBM test method flow chart
Annex B (informative) - HBM test equipment parasitic properties
Annex C (informative) - Example of testing a product using
        Table 2, Table 3, or Table 2 with a two-pin HBM tester
Annex D (informative) - Examples of coupled non-supply pin pairs
Annex E (normative) - Cloned non-supply (I/O) pin sampling
        test method
Bibliography

Defines the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).

This part of IEC 60749 establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).

The purpose of this document is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels.

ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. Unless otherwise specified, this test method is the one selected.