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IEC 60749-26:2013

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

31-12-2021

Language(s)

English - French

Published date

23-04-2013

IEC 60749-26:2013 establishes the procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD). The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of component type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels. ESD testing of semiconductor devices is selected from this test method, the machine model (MM) test method (see IEC 60749-27) or other ESD test methods in the IEC 60749 series. The HBM and MM test methods produce similar but not identical results; unless otherwise specified, this test method is the one selected. This edition includes the following significant technical changes with respect to the previous edition:
a) descriptions of oscilloscope and current transducers have been refined and updated;
b) the HBM circuit schematic and description have been improved;
c) the description of stress test equipment qualification and verification has been completely re-written;
d) qualification and verification of test fixture boards has been revised;
e) a new section on the determination of ringing in the current waveform has been added;
f) some alternate pin combinations have been included;
g) allowance for non-supply pins to stress to a limited number of supply pin groups (associated non-supply pins) and allowance for non-supply to non-supply (i.e., I/O to I/O) stress to be limited to a finite number of 2 pin pairs (coupled non-supply pin pairs);
h) explicit allowance for HBM stress using 2 pin HBM testers for die only shorted supply groups.

DocumentType
Standard
Pages
91
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy
Supersedes

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BS EN 62258-1:2010 Semiconductor die products Procurement and use
PD IEC/TR 61340-5-2:2018 Electrostatics Protection of electronic devices from electrostatic phenomena. User guide
BS EN 61340-5-3:2015 Electrostatics Protection of electronic devices from electrostatic phenomena. Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
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I.S. EN 60749-43:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
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BS IEC 60747-1 : 2006 SEMICONDUCTOR DEVICES - PART 1: GENERAL
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IEC 62149-3:2014 Fibre optic active components and devices - Performance standards - Part 3: Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems
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CEI EN 62149-4 : 2011 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION
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CSA ISO/IEC 10373-1 : 2007 : INC : AMD 1 : 2014 : R201200 IDENTIFICATION CARDS - TEST METHODS - PART 1: GENERAL CHARACTERISTICS
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I.S. EN 62005-9-1:2015 FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - RELIABILITY - PART 9-1: QUALIFICATION OF PASSIVE OPTICAL COMPONENTS
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I.S. EN 16603-20-08:2014 SPACE ENGINEERING - PART 20-08: PHOTOVOLTAIC ASSEMBLIES AND COMPONENTS
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IEC 61340-5-1:2016 RLV Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
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PD CLC/TR 61340-5-2:2008 Electrostatics Protection of electronic devices from electrostatic phenomena. User guide
BS EN 62149-3:2014 Fibre optic active components and devices. Performance standards Modulator-integrated laser diode transmitters for 2,5-Gbit/s to 40-Gbit/s fibre optic transmission systems
CSA ISO/IEC 10373-1:2007 IDENTIFICATION CARDS - TEST METHODS - PART 1: GENERAL CHARACTERISTICS
CEI EN 60749-43 : 1ED 2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
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ISO/IEC 10373-1:2006 Identification cards Test methods Part 1: General characteristics
IEC 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
IEC 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
IEC 61340-3-1:2006 Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers
IEC 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices
IEC 62149-4:2010 Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application
PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
EN 16603-20-08:2014 Space engineering - Part 20-08: Photovoltaic assemblies and components
13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
I.S. EN 62149-2:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 2: 850 NM DISCRETE VERTICAL CAVITY SURFACE EMITTING LASER DEVICES
BS IEC 62615:2010 Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
05/30128292 DC : DRAFT JAN 2005 IEC 60749-27 ED.2 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM)
04/30122195 DC : DRAFT SEP 2004 IEC 60747-1 - SEMICONDUCTOR DEVICES - DISCRETE DEVICES AND INTEGRATED CIRCUITS - PART 1: GENERAL
BS EN 62149-4:2010 Fibre optic active components and devices. Performance standards 1300 nm fibre optic transceivers for Gigabit Ethernet application
CSA ISO/IEC 10373-1 : 2007 : INC : AMD 1 : 2014 : R2017 IDENTIFICATION CARDS - TEST METHODS - PART 1: GENERAL CHARACTERISTICS
BS EN 61340-5-1:2016 Electrostatics Protection of electronic devices from electrostatic phenomena. General requirements
BS ISO/IEC 10373-1 : 2006 IDENTIFICATION CARDS - TEST METHODS - PART 1: GENERAL CHARACTERISTICS
S.R. CLC/TR 61340-5-2:2008 ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
I.S. EN 62149-8:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 8: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER DEVICES
I.S. EN 62149-9:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS
IEC 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
EN 60749-27:2006/A1:2012 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 27: ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING - MACHINE MODEL (MM)
IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
IEC 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
IEC 62005-9-1:2015 Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components
EN 62149-8:2014 Fibre optic active components and devices - Performance standards - Part 8: Seeded reflective semiconductor optical amplifier devices
CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
EN 61340-5-3:2015 Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
EN 62572-3:2016 Fibre optic active components and devices - Reliability standards - Part 3: Laser modules used for telecommunication
EN 62149-4:2010 Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application
EN 61340-3-1:2007 Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms
EN 62149-2:2014 Fibre optic active components and devices - Performance standards - Part 2: 850 nm discrete vertical cavity surface emitting laser devices
EN 62005-9-1:2015 Fibre optic interconnecting devices and passive components - Reliability - Part 9-1: Qualification of passive optical components
EN 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers

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