Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards

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Hardcopy , PDF

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English

Published date

07-04-2021

Publisher

British Standards Institution

Committee	EPL/501
DocumentType	Standard
Pages	36
PublisherName	British Standards Institution
Status	Current
Supersedes	BS EN 61188-5-1:2002

IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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BS EN IEC 61188-6-1:2021

Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards

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