• BS EN 61188-5-1 : 2002

    Current The latest, up-to-date edition.

    PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2002

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Design requirements
       4.1 General
            4.1.1 Classification
            4.1.2 Land pattern determination
       4.2 Dimensioning systems
            4.2.1 Component tolerancing
            4.2.2 Land tolerancing
            4.2.3 Fabrication allowances
            4.2.4 Assembly tolerancing
            4.2.5 Dimension and tolerance analysis
       4.3 Design producibility
            4.3.1 SMT land pattern
            4.3.2 Standard component selection
            4.3.3 Circuit substrate development
            4.3.4 Assembly considerations
            4.3.5 Provision for automated test
            4.3.6 Documentation for SMT
       4.4 Environmental constraint
            4.4.1 Moisture sensitive components
            4.4.2 End-use environment considerations
       4.5 Design rules
            4.5.1 Component spacing
            4.5.2 Single- and double-sided board assembly
            4.5.3 Solder paste stencil
            4.5.4 Component stand-off height for cleaning
            4.5.5 Fiducial marks
            4.5.6 Conductors
            4.5.7 Via guidelines
            4.5.8 Standard fabrication allowances
            4.5.9 Panelization
       4.6 Outer layer finishes
            4.6.1 Solder-mask finishes
            4.6.2 Solder-mask clearances
            4.6.3 Land-pattern finishes
    5 Quality and reliability validation
       5.1 Validation techniques
    6 Testability
       6.1 Five types of testing
            6.1.1 Bare-board test
            6.1.2 Assembled board test
       6.2 Nodal access
            6.2.1 Test philosophy
            6.2.2 Test strategy for bare boards
       6.3 Full nodal access for assembled board
            6.3.1 In-circuit test accommodation
            6.3.2 Multi-probe testing
       6.4 Limited nodal access
       6.5 No nodal access
       6.6 Clam-shell fixtures impact
       6.7 Printed board test characteristics
            6.7.1 Test land pattern spacing
            6.7.2 Test land size and shape
            6.7.3 Design for test parameters
    7 Printed board structure types
       7.1 General considerations
            7.1.1 Categories
            7.1.2 Thermal expansion mismatch
       7.2 Organic base material
       7.3 Non-organic base materials
       7.4 Alternative PB structures
            7.4.1 Supporting-plane PB structures
            7.4.2 High-density PB technology
            7.4.3 Discrete-wire interconnect
            7.4.4 Constraining core structures
            7.4.5 Porcelainized metal (metal core) structures
    8 Assembly considerations for surface-mount technology (SMT)
       8.1 SMT assembly process sequence
       8.2 Substrate preparation
            8.2.1 Adhesive application
            8.2.2 Conductive adhesive
            8.2.3 Solder paste application
            8.2.4 Solder preforms
       8.3 Component placement
            8.3.1 Component data transfer
       8.4 Soldering processes
            8.4.1 Wave soldering
            8.4.2 Vapour-phase soldering
            8.4.3 IR reflow
            8.4.4 Hot air/gas convection
            8.4.5 Laser reflow soldering
       8.5 Cleaning
       8.6 Repair/rework
            8.6.1 Re-use of removed components
            8.6.2 Heatsink effects
            8.6.3 Dependence on printed board material type
            8.6.4 Dependence on copper land and conductor layout
            8.6.5 Selection of suitable rework equipment
            8.6.6 Dependence on assembly structure and soldering
                  processes
    Annex A (informative) Test patterns - Process evaluations
    Annex B (informative) Abbreviations
    Annex ZA (normative) Normative references to international
                         publications with their corresponding
                         European publications
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Gives information on land pattern geometries used for the surface attachment of electronic components.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 95/208505 DC (04/2003)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60097 : 1993 GRID SYSTEMS FOR PRINTED CIRCUITS
    IEC 61188-1-1:1997 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60097:1991 GRID SYSTEM FOR PRINTED CIRCUITS
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    EN 61188-1-1 : 1997 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 1-1: GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
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