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  • BS EN IEC 61188-6-1:2021

    Current The latest, up-to-date edition.

    Circuit boards and circuit board assemblies. Design and use Land pattern design. Generic requirements for land pattern on circuit boards

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  07-04-2021

    Publisher:  British Standards Institution

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    IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes
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