BS EN ISO 3543:2001
Current
The latest, up-to-date edition.
Metallic and non-metallic coatings. Measurement of thickness. Beta backscatter method
Hardcopy , PDF
English
15-03-2001
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Foreword
1 Scope
2 Terms and definitions
3 Principle
4 Apparatus
5 Factors relating to measurement uncertainty
6 Calibration of instruments
7 Measuring procedure
8 Measurement uncertainty
9 Test report
Annex A (informative) General information
Defines a procedure for the non-destructive measurement of coating thicknesses using beta backscatter gauges. Relates to both metallic and non-metallic coatings on both metallic and non-metallic substrates. To use this method, the atomic numbers or equivalent atomic numbers of the coating and the substrate must differ by an appropriate amount. Includes references to definitions, principle, instrumentation, factors relating to accuracy, calibration of instruments, measuring procedure, measuring accuracy and precision, test report, isotopes used with beta backscatter gauges, atomic numbers of some commonly used coatings and substrates and saturation thickness.
| Committee |
STI/33
|
| DevelopmentNote |
Supersedes 97/120769 DC (03/2005) Renumbers and supersedes BS 5411-12(1981). 1995 Version incorporates amendment 8490 to BS 5411-12(1981). (10/2005)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| UNE-EN ISO 3543:2001 | Identical |
| SN EN ISO 3543 : 2001 | Identical |
| ISO 3543:2000 | Identical |
| UNI EN ISO 3543 : 2001 | Identical |
| NF EN ISO 3543 : 2001 | Identical |
| NEN EN ISO 3543 : 2001 C1 2007 | Identical |
| NS EN ISO 3543 : 2ED 2001 | Identical |
| NBN EN ISO 3543 : 2001 COR 2006 | Identical |
| I.S. EN ISO 3543:2001 | Identical |
| EN ISO 3543:2000 | Identical |
| DIN EN ISO 3543:2001-12 | Identical |
| DEFSTAN 03-9/3(2007) : 2007 | ELECTRO-DEPOSITION OF SILVER |
| BS 123800-003:2001 | System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections |
| BS 123100-003:2001 | System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes |
| SAE AMS 03-14 : 2018 | ELECTRODEPOSITION OF CHROMIUM FOR ENGINEERING PURPOSES |
| SAE AMS 03-040 : 2017 | ELECTRODEPOSITION OF ZINC-NICKEL ALLOYS |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| DEFSTAN 03-39/1(2008) : 2008 | ELECTRODEPOSITION OF ZINC-COBALT ALLOYS |
| BS 5577:1999 | Specification for table cutlery with non-metallic handles |
| BS CECC 123400-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
| DEFSTAN 03-17/3(2007) : 2007 | ELECTRO-DEPOSITION OF GOLD |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| SAE AMS 03-9 : 2017 | ELECTRO-DEPOSITION OF SILVER |
| SAE AMS 03-19A : 2017 | ELECTRO-DEPOSITION OF CADMIUM |
| DEFSTAN 03-19/4(2010) : 2010 | ELECTRO-DEPOSITION OF CADMIUM |
| DEFSTAN 03-19/3(2005) : 2005 | ELECTRO-DEPOSITION OF CADMIUM |
| BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
| SAE AMS 03-17 : 2018 | ELECTRO-DEPOSITION OF GOLD |
| BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
| BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
| DEFSTAN 03-40/1(2008) : 2008 | ELECTRODEPOSITION OF ZINC-NICKEL ALLOYS |
| BS CECC 123500-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
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