BS IEC 61163-2:1998
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Reliability stress screening Electronic components
Hardcopy , PDF
06-05-2020
English
15-02-1999
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INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Procedure
4.1 General
4.2 Programme definition
4.3 Establish contact between the two parties
involved
4.5 Select stress types, stress levels and stress
sequence to be used in order to precipitate
failures
4.6 Determine the duration of the reliability stress
screening process
4.7 Mathematically analyze initial test results
4.8 Perform failure analysis
4.9 Perform stress sequence on the components
4.10 Determine approval or rejection criteria
4.11 Develop closed-loop corrective action process
4.12 Provide feedback to the component manufacturers
4.13 Discontinue the reliability stress screening
process
Figure 1 Component reliability screening process (general
flow chart)
Figure 2 Corrective action process
Annex A (informative) Examples of tools for identifying
failure mechanisms in electronic components
Annex B (informative) Data analysis
Annex C (informative) Examples of applications of reliability
stress screening processes
Gives guidance on reliability stress screening techniques and methods for electronic components. Is not exhaustive due to the rapid development of the electronics industry.
| Committee |
DS/1
|
| DevelopmentNote |
Supersedes 96/402257 DC. (06/2005)
|
| DocumentType |
Standard
|
| Pages |
32
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| IEC 61163-2:1998 | Identical |
| 03/101534 DC : DRAFT JAN 2003 | BS 5760-4 - RELIABILITY OF SYSTEMS, EQUIPMENT AND COMPONENTS - PART 4: GUIDE TO THE SPECIFICATION OF DEPENDABILITY REQUIREMENTS |
| BS 5760-4:2003 | Reliability of systems, equipment and components Guide to the specification of dependability requirements |
| IEC 61163-1:2006 | Reliability stress screening - Part 1: Repairable assemblies manufactured in lots |
| IEC 61709:2017 | Electric components - Reliability - Reference conditions for failure rates and stress models for conversion |
| IEC 60300-1:2014 | Dependability management - Part 1: Guidance for management and application |
| IEC 60300-3-7:1999 | Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware |
| IEC 60300-2:2004 | Dependability management - Part 2: Guidelines for dependability management |
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