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IEC 60300-3-7:1999

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware

Available format(s)

Hardcopy , PDF

Language(s)

English - French

Published date

31-05-1999

Superseded date

11-07-2007

€267.36
Excluding VAT
Summarise this standard

Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Acronyms
5 General considerations for a reliability stress
    screening programme
6 General information about the reliability stress
    screening process
7 Analysis of the benefits of the reliability stress
    screening process
8 Characteristics of a successful reliability stress
    screening programme
9 Screening types
10 Screening levels
11 Screening strength
12 Selection of screens
13 Flaws detected by a reliability stress concerning
    process
14 Pre-production screening process
15 Planning, performing and eliminating a reliability
    stress screening process
    15.1 General
    15.2 Step 1 - Identification of objectives and
           goals
    15.3 Step 2 - Screening process design and
           application
    15.4 Step 3 - Cost-benefit analysis
    15.5 Step 4 - Preparation of a screening plan
    15.6 Step 5 - Screening process data collection,
           analysis and corrective actions
Figures
1 Levels where reliability stress screening can be
    performed
2 Reliability stress screening of repairable items
3 Flow chart for control of a reliability stress
    screening process
A.1 Level chosen for the RSS process
Tables
A.1 Relation between the sensitivity of flaws and stresses
Annex A (informative) RSS of repairable items produced
in lots
Annex B (informative) RSS of electronic components

Serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The standard is intended as a guide to be used with one of the IEC reliability stress screening standards. It gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. It gives guidance on where the reliability stress screening should be carried out, i.e. component, subsystem or system level.

DocumentType
Standard
Pages
69
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

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€267.36
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