BS IEC 62528:2007
Current
The latest, up-to-date edition.
Standard testability method for embedded core-based integrated circuits
Hardcopy , PDF
English
31-12-2007
IEEE Introduction
1 Overview
1.1 Scope
1.2 Purpose
2 Normative references
3 Definitions, acronyms, and abbreviations
3.1 Definitions
3.2 Acronyms and abbreviations
4 Structure of this standard
4.1 Specifications
4.2 Descriptions
5 Introduction and motivations of two compliance levels
6 Overview of the IEEE 1500 scalable hardware architecture
6.1 Wrapper serial port (WSP)
6.2 Wrapper parallel port (WPP)
6.3 Wrapper instruction register (WIR)
6.4 Wrapper bypass register (WBY)
6.5 Wrapper boundary register (WBR)
7 WIR instructions
7.1 Introduction
7.2 Response of the wrapper circuitry to instructions
7.3 Wrapper instruction rules and naming convention
7.4 WS_BYPASS Instruction
7.5 WS_EXTEST instruction
7.6 WP_EXTEST instruction
7.7 Wx_EXTEST instruction
7.8 WS_SAFE instruction
7.9 WS_PRELOAD instruction
7.10 WP_PRELOAD instruction
7.11 WS_CLAMP instruction
7.12 WS_INTEST_RING instruction
7.13 WS_INTEST_SCAN instruction
7.14 Wx_INTEST instruction
8 Wrapper serial port (WSP)
8.1 WSP terminals
9 Wrapper parallel port (WPP)
9.1 WPP terminals
10 Wrapper instruction register (WIR)
10.1 WIR configuration and DR selection
10.2 WIR design
10.3 WIR operation
11 Wrapper bypass register (WBY)
11.1 WBY register configuration and selection
11.2 WBY design
11.3 WBY operation
12 Wrapper boundary register (WBR)
12.1 WBR structure and operation
12.2 WBR cell structure and operation
12.3 WBR operation events
12.4 WBR operation modes
12.5 Parallel access to the WBR
12.6 WBR cell naming
12.7 WBR cell examples
12.8 IEEE 1500 WBR example
13 Wrapper states
13.1 Wrapper Disabled and Wrapper Enabled states
14 WSP timing diagram
14.1 Specifications
14.2 Description
14.3 Synchronous reset timing
15 WSP configurations for IEEE 1500 system chips
15.1 Connecting multiple WSPs
16 Plug-and-play (PnP)
16.1 Background and definition
16.2 PnP aspects of standard instructions
16.3 PnP limitations on protocols
16.4 Non-PnP in IEEE Std 1500
17 Compliance definitions common to wrapped and unwrapped cores
17.1 General rules
17.2 Per-terminal rules
17.3 Test pattern information rules
18 Compliance definitions specific to unwrapped cores
18.1 General rules
18.2 Per-terminal rules
18.3 Additional test information rules
19 Compliance definitions specific to wrapped cores
19.1 General rules
19.2 Per-terminal rules
19.3 Wrapper protocol information rules
20 IEEE 1500 application
20.1 CTL (IEEE P1450.6) overview
20.2 IEEE 1500 examples
Annex A (normative) - Bubble diagram definition
Annex B (informative) - WBR cell examples
Annex C (informative) - Relationship of IEEE Std 1500 to
IEEE Std 1149.1
Annex D (informative) - List of participants
Defines a scalable architecture for independent, modular test development and test application for embedded design blocks and also enables test of the external logic surrounding these cores.
Committee |
EPL/501
|
DevelopmentNote |
Reviewed and confirmed by BSI, November 2010. (11/2010)
|
DocumentType |
Standard
|
Pages |
126
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Defines a mechanism for the test of core designs within a system on chip (SoC).This mechanism constitutes a hardware architecture and leverages the core test language (CTL)to faciliate communication between core designers and core integrators.
Standards | Relationship |
IEEE 1500:2007 | Identical |
IEC 62528:2007 | Identical |
IEEE 1149.1-2013 REDLINE | IEEE Standard for Test Access Port and Boundary-Scan Architecture |
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