Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
3.1 Anisotropic Conductive Film (ACF)
3.2 Chip on Film, Foil or Flex (COF)
3.3 Direct Chip Attach (DCA)
3.4 Tape Carrier Package (TCP)
3.5 Underfill
4 Conformity levels
5 Specific recommendations - Test and quality
5.1 General
5.2 Probing of bumped or TAB die
5.3 Traceability
6 Specific recommendations - User or assembler
related issues, techniques, best practice and
material selection
6.1 General
6.2 Bump material
6.3 Solder types
6.4 Distortion or dimensional tolerance of bumps
6.5 Fluxing required
6.6 Adhesive and underfill
6.7 Encapsulation material
6.8 Peak temperature and duration
6.9 TCE considerations
6.10 Mounting limitations
7 Specific recommendations - Handling, including pick
& place issues, and storage
7.1 General
7.2 Backside fiducials
7.3 Die identity marking
7.4 Unusual handling limitations
7.5 Protection of connection structures
7.6 Specific handling precautions when opening
primary packing
7.7 Orientation
7.8 Storage
8 Specific recommendations - Thermal, including
modelling
8.1 General
8.2 Backside heat-sinking
8.3 Thermal management of bumped die
9 Specific recommendations - Electrical, including
simulation
9.1 General
9.2 Redistribution of bond pads
9.3 Die backside connection
10 Specific recommendations - Application
environment
10.1 General
10.2 Photo-sensitivity
10.3 Optical, photo emitters
10.4 Extended temperature
10.5 MEMS requirements (chemical, magnetic,
mechanical, biological etc) and the
need to protect other die
11 Summary of information requirements