ES 59008-5-2 : 2001

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DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - PART 5-2: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - BARE DIE WITH ADDED CONNECTION STRUCTURES

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Withdrawn date: 21-03-2022

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Published date: 12-01-2013

Publisher: European Committee for Standards - Electrical

Pure ENs are not available for sale, please purchase a suitable national adoption

Table of Contents - (Show below) - (Hide below)

Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
   3.1 Anisotropic Conductive Film (ACF)
   3.2 Chip on Film, Foil or Flex (COF)
   3.3 Direct Chip Attach (DCA)
   3.4 Tape Carrier Package (TCP)
   3.5 Underfill
4 Conformity levels
5 Specific recommendations - Test and quality
   5.1 General
   5.2 Probing of bumped or TAB die
   5.3 Traceability
6 Specific recommendations - User or assembler
   related issues, techniques, best practice and
   material selection
   6.1 General
   6.2 Bump material
   6.3 Solder types
   6.4 Distortion or dimensional tolerance of bumps
   6.5 Fluxing required
   6.6 Adhesive and underfill
   6.7 Encapsulation material
   6.8 Peak temperature and duration
   6.9 TCE considerations
   6.10 Mounting limitations
7 Specific recommendations - Handling, including pick
   & place issues, and storage
   7.1 General
   7.2 Backside fiducials
   7.3 Die identity marking
   7.4 Unusual handling limitations
   7.5 Protection of connection structures
   7.6 Specific handling precautions when opening
       primary packing
   7.7 Orientation
   7.8 Storage
8 Specific recommendations - Thermal, including
   modelling
   8.1 General
   8.2 Backside heat-sinking
   8.3 Thermal management of bumped die
9 Specific recommendations - Electrical, including
   simulation
   9.1 General
   9.2 Redistribution of bond pads
   9.3 Die backside connection
10 Specific recommendations - Application
   environment
   10.1 General
   10.2 Photo-sensitivity
   10.3 Optical, photo emitters
   10.4 Extended temperature
   10.5 MEMS requirements (chemical, magnetic,
        mechanical, biological etc) and the
        need to protect other die
11 Summary of information requirements

Abstract - (Show below) - (Hide below)

Gives requirements for the exchange of data pertaining to bare semiconductor die with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice for handling bare die, with or without connection structures and minimally-packaged die.

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Committee	BTTF 97-1
Development Note	Also numbered as BS PD ES 59008-5-2 (05/2001)
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Withdrawn

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Equivalent Standard(s)	Relationship
BS PD ES 59008-5.2 : 2001	Identical
PD ES 59008-5-2:2001	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

ES 59008-1 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS
PD ES 59008-1:2000	Data requirements for semiconductor die General requirements

Standards Referencing This Book - (Show below) - (Hide below)

ES 59008-4-1 : 2000	DATA REQUIREMENTS FOR SEMI-CONDUCTOR DIE - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - TEST AND QUALITY
FED-STD-209 Revision E:1992	AIRBORNE PARTICULATE CLEANLINESS CLASSES IN CLEANROOMS AND CLEAN ZONES
ES 59008-3 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 3 - MECHANICAL, MATERIAL AND CONNECTIVITY REQUIREMENTS
ES 59008-1 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 1 - GENERAL REQUIREMENTS
ES 59008-2 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 2 - VOCABULARY
ES 59008-4-3 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-3 - SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - THERMAL
ES 59008-4-4 : 1999	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 4-4: SPECIFIC REQUIREMENTS AND RECOMMENDATIONS - ELECTRICAL SIMULATION
ES 59008-4-2 : 2000	DATA REQUIREMENTS FOR SEMICONDUCTOR DIE : SPECIFIC REQUIREMENTS AND RECOMMENDATIONS HANDLING AND STORAGE

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