CECC 23200-801 : 1998
Current
The latest, up-to-date edition.
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - CAPABILITY DETAIL SPECIFICATION: SINGLE AND DOUBLE-SIDED PRINTED BOARDS WITH PLATED THROUGH HOLES
12-01-2013
Foreword
1 General
2 Capability qualifying component
3 Capability approval
4 Capability test programme
5 Additional capability
6 Traceability
Annex A - Suitable test pattern for marking inks
Annex B - Suitable test pattern for solder masks
Annex C - Suitable test pattern for bonded heatsinks
Annex D - Edge connector imperfections
Annex E - CTP subdivision for thermal shock
Annex F - Circumferential defects in plated-through holes
Annex G - Determination of characteristic impedance by TDR
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