CEI 56-36 : 2000
Current
The latest, up-to-date edition.
RELIABILITY STRESS SCREENING - PART 2: ELECTRONIC COMPONENTS
Hardcopy , PDF
English
01-01-2000
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Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Procedure
Annex A (informative) - Examples of tools for
identifying failure mechanisms in
electronic components
Annex B (informative) - Data analysis
Annex C (informative) - Examples of applications
of reliability stress screening processes
Gives a guide on reliability stress screening techniques and procedures for electronic components. This standard is meant for the use of component manufacturers as a guideline, and component users as a guideline for negotiating with component manufacturers on stress screening requirements also subcontractors who give stress screening as a service.
| Committee |
CT 56
|
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| SupersededBy |
| Standards | Relationship |
| IEC 61163-2:1998 | Identical |
| IEC 61163-1:2006 | Reliability stress screening - Part 1: Repairable assemblies manufactured in lots |
| IEC 60300-1:2014 | Dependability management - Part 1: Guidance for management and application |
| IEC 60300-3-7:1999 | Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware |
| IEC 60300-2:2004 | Dependability management - Part 2: Guidelines for dependability management |
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