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Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Amendment of: CEI EN 60068-2-58 : 2016
Available format(s): Hardcopy, PDF
Language(s): English
Published date: 26-03-2019
Publisher: Comitato Elettrotecnico Italiano
This variant is published by the CEI in the English language only as it is particularly aimed at specialist sectors.
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