• CEI EN 60068-2-58 : 2016

    Current The latest, up-to-date edition.

    ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2016

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Grouping of soldering processes and related test
       severities
    5 Test equipment
    6 Test Td[1]: Solderability of terminations
    7 Test Td[2]: Resistance to soldering heat
    8 Test Td[3]: Dewetting and resistance to dissolution of
       metallization
    9 Final measurements
    10 Information to be given in the relevant specification
    Annex A (normative) - Criteria for visual examination
    Annex B (informative) - Guidance
    Annex C (normative) - Application of the test methods to
            through hole reflow soldering components (THR)
    Annex X (informative) - Cross reference for references
            to the prior revision of this specification
    Bibliography
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Specifies procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Supersedes CEI 50-8/5 (02/2003) Classificazione CEI 91-26. (09/2005) 2ED 2005 Edition remains current and will be withdrawn on 01/05/2018. (02/2016)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20 : 2008 ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    EN 61190-1-1 : 2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    EN 60068-1:2014 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN 61249-2-35 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    EN ISO 9454-2 : 2000 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    EN 61249-2-22 : 2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 61190-1-1:2002 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61249-2-35:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61249-2-22:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    EN 61190-1-2:2014 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
    EN 60194:2006 PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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