CEI EN 60191-6-19 : 2011
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF THE PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
Hardcopy , PDF
English
01-10-2011
FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Sample
5. Measurement
6. Maximum permissible package warpage at
elevated temperature
7. Recommended datasheet for the package
warpage
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-76. (11/2011)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-6-19:2010 | Identical |
| IEC 60191-6-19:2010 | Identical |
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