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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-01-2004
Publisher: Comitato Elettrotecnico Italiano
FOREWORD1 Scope2 Normative references3 Terms and definitions4 Test apparatus5 Procedure6 Summary
Describes a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.
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