IEC 60749-25:2003
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
Hardcopy , PDF
English - French
11-07-2003
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
5.1 Initial measurements
5.2 Conditioning
5.3 Cycle rates
5.4 Upper and lower soak times
5.5 Upper and lower soak temperatures
5.6 Soak modes
5.7 Cycle time
5.8 Ramp rate
5.9 Load transfer time
5.10 Recovery
5.11 Final measurements
5.12 Failure criteria
6 Summary
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
| Committee |
TC 47
|
| DevelopmentNote |
Supersedes IEC PAS 62178. (07/2003) Supersedes IEC 60749. (03/2008) Stability Date: 2020. (11/2017)
|
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NF EN 60749-25 : 2003 | Identical |
| NEN EN IEC 60749-25 : 2003 | Identical |
| I.S. EN 60749-25:2003 | Identical |
| PN EN 60749-25 : 2006 | Identical |
| CEI EN 60749-25 : 2004 | Identical |
| EN 60749-25:2003 | Identical |
| DIN EN 60749-25:2004-04 | Identical |
| BS EN 60749-25:2003 | Identical |
| BS EN 60068-2-30:1999 | Identical |
| UNE-EN 60749-25:2004 | Identical |
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