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  • CEI EN 60749-35 : 2012

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 35: ACOUSTIC MICROSCOPY FOR PLASTIC ENCAPSULATED ELECTRONIC COMPONENTS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2012

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Terms and definitions
    3 Test apparatus
    4 Procedure
    Annex A (informative) - Acoustic
            microscopy check sheet
    Annex B (informative) - Potential
            image pitfalls
    Annex C (informative) - Some
            limitations of acoustic
            microscopy
    Annex D (informative) - Reference
            checklist for presenting
            applicable scanned data
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 47-87. (03/2012)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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