EN 60749-35:2006

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Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

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Published date: 20-09-2006

Publisher: European Committee for Standards - Electrical

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Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Terms and definitions
3 Test apparatus
  3.1 Reflective acoustic microscope system
  3.2 Through transmission acoustic microscope system
  3.3 Reference packages or standards
  3.4 Sample holder
4 Procedure
  4.1 General
  4.2 Equipment setup
  4.3 Performance of acoustic scans
Annex A (informative) Acoustic microscopy check sheet (example
        only - not a mandatory template)
Annex B (informative) Potential image pitfalls
Annex C (informative) Some limitations of acoustic microscopy
Annex D (informative) Reference checklist for presenting
        applicable scanned data
Bibliography

Abstract - (Show below) - (Hide below)

Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

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Committee	CLC/SR 47
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

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Equivalent Standard(s)	Relationship
NF EN 60749-35 : 2006	Identical
IEC 60749-35:2006	Identical
NBN EN 60749-35 : 2007	Identical
NEN EN IEC 60749-35 : 2006	Identical
I.S. EN 60749-35:2006	Identical
PN EN 60749-35 : 2009	Identical
UNE-EN 60749-35:2006	Identical
BS EN 60749-35:2006	Identical
CEI EN 60749-35 : 2012	Identical
DIN EN 60749-35:2007-03	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

EN 60749-20:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
CEI EN 60749-20 : 2010	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
BS EN 60749-20:2009	Semiconductor devices. Mechanical and climatic test methods Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
I.S. EN 60749-20:2009	SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60749-20:2008	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
EN 60749-20:2009	Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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