CEI EN 61191-3 : 2018
Current
Current
The latest, up-to-date edition.
Printed board assemblies Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
24-01-2019
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 61191 prescribes requirements for lead and hole solder assemblies.
| Committee |
CT 309
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-4397-8
|
| Pages |
0
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 61191-3:2017 | Identical |
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