EN 61191-3:2017

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Through-hole mounting of components
6 Acceptance requirements
7 Rework of unsatisfactory solder connections
Annex A (normative) - Placement requirements for
        through-hole mount devices
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).This edition includes the following significant technical changes with respect to the previous edition:a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.