CEI EN 61760-3 : 2010
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
Hardcopy , PDF
English
01-10-2010
11-11-2021
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements to component design and component specifications
5 Specification of assembly process conditions
6 Typical process conditions
7 Requirements for components and component specifications
for THR soldering processes
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Defines a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 309-19. (12/2010)
|
| DocumentType |
Standard
|
| Pages |
48
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC 61760-3:2010 | Identical |
| EN 61760-3:2010 | Identical |