IEC 61760-3:2010

FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 Requirements to component design and component
  specifications
5 Specification of assembly process conditions
6 Typical process conditions
7 Requirements for components and component specifications
  for THR soldering processes

IEC 61760-3:2010 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology. The object of this standard is to ensure that components with leads intended for through hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this standard defines test and requirements that need to be part of any component generic, sectional or detail specification, when through hole reflow soldering is intended. Further this standard provides component users and manufacturers with a reference set of typical process conditions used in through hole reflow soldering technology.