CEI EN 62047-13 : 2013
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
Hardcopy , PDF
English
01-01-2013
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test method
5 Test equipment
6 Test pieces
7 Test conditions
8 Test report
Annex A (informative) - Technical background
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 309-35. (05/2013)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62047-13:2012 | Identical |
| EN 62047-13:2012 | Identical |
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| EN 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
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