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CEI EN 62047-13 : 2013

CEI EN 62047-13 : 2013

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2013

Publisher

Comitato Elettrotecnico Italiano

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test method
5 Test equipment
6 Test pieces
7 Test conditions
8 Test report
Annex A (informative) - Technical background
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens.

Committee
CT 309
DevelopmentNote
Classificazione CEI 309-35. (05/2013)
DocumentType
Standard
Pages
22
PublisherName
Comitato Elettrotecnico Italiano
Status
Current

Standards Relationship
IEC 62047-13:2012 Identical
EN 62047-13:2012 Identical

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

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